Lam Research
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam Research 2300 Kiyo EX is a polysilicon etch tool. The Lam Research 2300 Kiyo EX is configured for 300 mm wafers. The Lam Research 2300 Kiyo EX is etch/ash/clean plasma processing equipment.[1][2]
An etch system removes selected material from a wafer by exposing the surface to a controlled plasma environment while masking regions that must remain intact.
A plasma processing tool uses process chambers, gas delivery, vacuum conditions, and electrical power to sustain reactive species that drive material removal and pattern transfer.
The Lam Research 2300 Kiyo EX sits in the pattern transfer portion of semiconductor fabrication after lithographic definition and before later clean, deposition, or thermal steps.
A polysilicon etch system is used when a patterned polysilicon layer must be opened or shaped without removing protected regions.
Documented failure modes, common issues, and field considerations.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The system power rating is 208 V AC, 3-phase.[2]
The N2 load ports are supplied by JUSTEM.[2]
The system has three load ports.[2]
The following facts about the 2300 Kiyo EX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Kiyo EX are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 Kiyo EX are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 Kiyo EX are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2300 Kiyo EX is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2300 Kiyo EX are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 2, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.