Waferpedia

Comparison ledger

0041-39086 ESC Partversus2300 Kiyo EX

Applied Materials 0041-39086 ESC Part, Lam Research 2300 Kiyo EX, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
2300 Kiyo EXLam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Lam Research 2300
Specifications
Configuration—Polysilicon[1]
OEM—Lam Research[1]
Model—2300 Kiyo EX[1]
Description—Polysilicon Etch[2]
Equipment type—Etch/Ash/Clean - Plasma Processing Equipment[2]
Currently configured for—300 mm[2]
Tool model—KIYOEX[2]
System power rating—208 AC 3-Phase[2]
Loading configuration—3 Load ports[2]
Chambers—Chamber 1, Chamber 2, Chamber 3[2]
Chamber descriptions—KIYOEX, KIYOEX, KIYOEX[2]
Process Type—Polysilicon Etch[2]
Wafer Size—300mm[2]
Load Ports—3[2]
Chamber Type—KIYOEX[2]
N2 Load Port Vendor—JUSTEM[2]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]macquarie.commacquarie.com