Waferpedia

Comparison ledger

200 ACUversus2300 Kiyo EX

Axcelis 200 ACU, Lam Research 2300 Kiyo EX, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
2300 Kiyo EXLam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300
Specifications
ConfigurationParts Machine[1]Polysilicon[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]2300 Kiyo EX[5]
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Etch/Ash/Clean - Plasma Processing Equipment[6]
Wafer configuration8 inch[2]—
OEM—Lam Research[5]
Description—Polysilicon Etch[6]
Currently configured for—300 mm[6]
Tool model—KIYOEX[6]
System power rating—208 AC 3-Phase[6]
Loading configuration—3 Load ports[6]
Chambers—Chamber 1, Chamber 2, Chamber 3[6]
Chamber descriptions—KIYOEX, KIYOEX, KIYOEX[6]
Process Type—Polysilicon Etch[6]
Wafer Size—300mm[6]
Load Ports—3[6]
Chamber Type—KIYOEX[6]
N2 Load Port Vendor—JUSTEM[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]macquarie.commacquarie.com