Kulicke & Soffa
IBond 5000
The K&S IBond 5000 is a manual wire bonder manufactured by Kulicke & Soffa. The IBond 5000 features ball-wedge bonding capability. The IBond 5000 supports gold and copper wire diameters from 0.7 mil to 3.0 mil.[1][2]
How it works
The XY table provides a bonding area of 135 by 135 millimeters. The throat depth is 143 millimeters. Gross and fine table motion are each 14 millimeters. The motorized Y axis can achieve setback up to 4 millimeters, reverse up to 0.25 inches or 10 mils, and kink height up to 0.5 millimeters or 20 mils. The Z axis has a travel of 0.500 inches or 12.5 millimeters.[1]
Applications
The machine can bond gold wire and copper wire, with diameters ranging from 0.7 to 3.0 mils for gold and 0.7 to 2 mils for copper.[1]
What do the numbers mean?
Power & electrical9
- 100-240 V, 50/60 Hz[1]
Control & software2
Dimensions & facilities4
- Bond force range
- 10-250 grams (requires added weights >80 grams), force coil range 3-80 grams[1]
Configuration & options45
- Ball-wedge bonding capability[1]
- Wire feed angle 90 degrees, vertical feed[1]
- Gold Wire Diameter:[1]
- Ball bonding and wedge bonding[1]
- 0.7 mil to 3.0 mil diameter[1]
- 17 micron to 75 micron diameter[1]
- Copper Wire[1]
- 0.7 mil ro 2 mil[1]
- 12 micron to 50 micron[1]
- Bonding Tool Specifications:[1]
- Ball bonding capillary lengths[1]
- 0.375"[1]
- 0.437"[1]
- 0.625"[1]
- XY Table:[1]
Vintage & configurations
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AB 559 A 06 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[5]
- ASM AD 838 L— Same function class: Packaging & Bonding, UnknownCompare in depthsource[6]
- Branson 318-008-021 Horn— Same function class: Packaging & Bonding, nullCompare in depthsource[7]
- Shinkawa UTC 5000— Same function class: Packaging & Bonding, nullCompare in depthsource[8]
- Besi DS 9000 E— Same function class: Packaging & Bonding, nullCompare in depthsource[9]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration100-240 V, 50/60 Hz[1]
- Power supply100-240 V, 50/60 Hz[1]
- Ultrasonic transducer frequency60 kHz[1]
- Ultrasonic generatorPhase Lock Loop self-tuning[1]
- Low ultrasonic power1.3 watts[1]
- High ultrasonic power2.5 watts[1]
- Input power100-240 V, 50/60 Hz[1]
- Ultrasonic systemHigh Q 60kHz K&S transducer[1]
- Ultrasonic generatorPhase Lock Loop self-tuning ultrasonic generator[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of wire can be used in a wire bonder of this class?General reference — not yet source-verified
Such machines typically support gold and copper wire, and sometimes silver alloy wires, depending on the application and the machine's configuration.
How is bond quality monitored during operation?General reference — not yet source-verified
Many machines in this class incorporate in-line process control features such as shear testing, bond force sensing, and optical inspection to monitor parameters like bond placement, loop shape, and bond integrity.
What is the typical size range of devices that can be handled?General reference — not yet source-verified
The machine can accommodate a range of package sizes and die dimensions, with the exact capability depending on the tooling and configuration installed.
Not publicly documented
The following facts about the IBond 5000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IBond 5000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the IBond 5000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IBond 5000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IBond 5000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IBond 5000 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]web.archive.org — kns.com (Sep 5, 2012)web.archive.org
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
- [7]Equipment inventory listing
- [8]web.archive.orgweb.archive.org
- [9]Equipment inventory listing
Last updated Sep 28, 2026.
Compare with similar tools
View all →Branson 318-008-021 Horn is a circular high grain horn with a 3-inch diameter, 0.9 horn gain, and a black max booster.
The ASM AB 559 A 06 is a wedge bonder offered by ASM.
The Besi / Datacon DS 9000 E is a bonder with an 8-inch wafer size and 208 VAC single-phase, 50/60 Hz power specifications.
The Shinkawa UTC 5000 is a wire bonder that handles 12-inch wafers.
