Besi
DS 9000 E
The Besi DS 9000 E is a bonder. The Besi DS 9000 E has an 8-inch wafer size. The Besi DS 9000 E uses 208 VAC single-phase, 50/60 Hz power.[1][2][3]
What it is
The Besi DS 9000 E is a bonder in semiconductor packaging and bonding.[2]
How it works
General reference — not yet source-verifiedA bonder joins semiconductor parts by making controlled mechanical and thermal connections between dies, substrates, leadframes, or other package elements.
Packaging and bonding equipment is used to form interconnects and attach components during assembly after front-end wafer processing.
Where it fits in the process flow
General reference — not yet source-verifiedThe DS 9000 E belongs in semiconductor back-end assembly rather than in wafer fabrication.
Bonders operate after device formation on the wafer and before final package completion and test.
Applications
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Kulicke & Soffa IBond 5000— Same function class: Packaging & Bonding, nullCompare in depthsource[1]
- Shinkawa UTC 1000— Same function class: Packaging & Bonding, nullCompare in depthsource[1]
- Kulicke & Soffa Rapid Pro Automatic— Same function class: Packaging & Bonding, nullCompare in depthsource[1]
- Palomar 8000 i— Same function class: Packaging & Bonding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Besi DS 9000 E?
The Besi DS 9000 E is a bonder for semiconductor packaging and bonding.[2]
Not publicly documented
The following facts about the DS 9000 E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DS 9000 E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DS 9000 E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DS 9000 E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DS 9000 E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DS 9000 E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Besi DS 9000 E family | Waferpedia — waferpedia.comwaferpedia.com
- [4]Inventory photo
Last updated Oct 9, 2026.
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The Palomar 8000 i is a wire bonder and ball bumper for complex, high-mix automated production. The Palomar 8000 i is a fully automated thermosonic high-speed, ball-and-stitch wire bonder with ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles.
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
The K&S Rapid Pro Automatic Wire Bonder is an automatic ball bonder from the GEN-S series designed for high-performance semiconductor packaging with real-time monitoring and diagnostics.
The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.
