ASM
AB 559 A 06 Wedge
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedA wedge bonder is a type of wire bonder used in semiconductor packaging to connect an integrated circuit die to its package or substrate. The bonder uses a wedge-shaped tool to press wire against a bond pad and applies ultrasonic energy to create a metallurgical bond.
How it works
General reference — not yet source-verifiedWedge bonders operate by feeding wire through a hollow capillary or a wire clamp and then pressing a wedge-shaped bonding tool onto the wire resting on a bond pad. Ultrasonic vibrations are transmitted through the wedge to the wire, generating frictional heat that softens the wire and forms a solid-state weld with the pad. The wedge then moves to the next bond location, paying out wire, and repeats the process. After the second bond, the wire is clamped and torn to create a wedge-shaped termination.
Where it fits in the process flow
General reference — not yet source-verifiedWedge bonding is a back-end assembly step performed after wafer dicing and die attach, and before encapsulation or molding. The wedge bonder connects bond pads on the die to lead fingers or substrate pads using fine wire, typically aluminum or gold. Downstream processes include plasma cleaning, inspection, and encapsulation.
What do the numbers mean?
Power & electrical4
Control & software2
Configuration & options4
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- West Bond 7476 E 79 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[1]
- Hesse & Knipps BJ 820 V 1 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[1]
- Kulicke & Soffa IBond 5000— Same function class: Packaging & Bonding, UnknownCompare in depthsource[1]
- Kulicke & Soffa Asterion SV Hybrid Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of equipment is the ASM AB 559 A 06?
It is a wedge bonder.[3]
Not publicly documented
The following facts about the AB 559 A 06 Wedge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AB 559 A 06 Wedge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AB 559 A 06 Wedge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AB 559 A 06 Wedge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AB 559 A 06 Wedge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AB 559 A 06 Wedge is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
Last updated Oct 10, 2026.
Compare with similar tools
View all →
The WestBond 7476 E 79 Wedge is a wedge wire bonder with deep access and several specified operating features.
The K&S Asterion SV Hybrid Wedge Bonder is a bond equipment model with a 300 mm x 95 mm bondable area and several listed electrical and pneumatic specifications.
Hesse & Knipps (H&K) BJ 820 V 1 Wedge Bonder.
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
