Shinkawa
UTC 5000
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA wire bonder places and bonds fine wire interconnects between a die and its package or substrate pads.
A packaging bonder in this class aligns the workpiece and bonding tool, applies controlled energy and force, and creates the interconnects needed for device assembly.
Where it fits in the process flow
General reference — not yet source-verifiedThe UTC 5000 belongs in the back-end assembly flow, after wafer processing and singulation and before final package completion and test.
The UTC 5000 sits in the bonding step where the die is attached into a package assembly and electrical paths are formed to the package interconnect structure.
Applications
What do the numbers mean?
Wafer handling1
Control & software1
- Software included[1]
Configuration & options3
- Complete with HDD[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Kulicke & Soffa IBond 5000— Same function class: Packaging & Bonding, nullCompare in depthsource[2]
- Palomar 8000 i— Same function class: Packaging & Bonding, nullCompare in depthsource[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the UTC 5000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 5000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 5000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 5000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 5000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 5000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]web.archive.org — shinkawa.com (Dec 15, 2019)web.archive.org
Last updated Oct 10, 2026.
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