Zeiss
The Zeiss Ultra-55 is a lithography-category tool. The Zeiss Ultra-55 has a wafer size of 300mm. The Zeiss Ultra-55 is a field emission scanning electron microscope platform used with Zyvex S-100 Nanoprobes.[1][2][3]
Wafer size
300mm
Performance
Five nanometers[3]
The Zeiss Ultra-55 operates under vacuum during imaging or with the beam blanked. The installed nanoprobes operate under vacuum during imaging or with the beam blanked.[1]
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The Zeiss Ultra-55 supports 300 mm wafers.[1]
The placement precision is five nanometers.[1]
The system includes three individually controlled nanoprobes.[1]
The minimum tip radius is fifty nanometers.[1]
The Zeiss Ultra-55 operates under vacuum during imaging or with the beam blanked.[1][2]
The instrument type is a field emission scanning electron microscope (FESEM).[1]
The following facts about the Ultra-55 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ultra-55 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Ultra-55 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ultra-55 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Ultra-55 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Ultra-55 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 6, 2026.
The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.
The MA300 Gen2 is an automated mask aligner from SUSS MicroTec for proximity exposure of wafers up to 300 mm.
The JEOL JBX-9500FS Electron Beam Lithography System can load substrates from 10 mm pieces to 300 mm wafers and write features less than 10 nm in size.