SUSS MicroTec
The MA300 Gen2 is an automated mask aligner from SUSS MicroTec for proximity exposure. The MA300 Gen2 handles wafers up to 300 mm.[1]
Wafer size
300mm
Optics
Proximity exposure[1]
Process applications and technology nodes documented for this tool.
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The following facts about the MA300 Gen2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA300 Gen2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA300 Gen2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA300 Gen2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA300 Gen2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA300 Gen2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.
The JEOL JBX-9500FS Electron Beam Lithography System can load substrates from 10 mm pieces to 300 mm wafers and write features less than 10 nm in size.
ASML Twinscan XT 1950 Hi is a scanner for 12-inch wafers used for 193 nm immersion lithography with 38 nm resolution capacity.