Besi
DS 9000 E alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Palomar
8000 i
Packaging & Bonding
The Palomar 8000 i is a wire bonder and ball bumper for complex, high-mix automated production. The Palomar 8000 i is a fully automated thermosonic high-speed, ball-and-stitch wire bonder with ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles.
Kulicke & Soffa
IBond 5000
Packaging & Bonding
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
Kulicke & Soffa
Rapid Pro Automatic
Packaging & Bonding
The K&S Rapid Pro Automatic Wire Bonder is an automatic ball bonder from the GEN-S series designed for high-performance semiconductor packaging with real-time monitoring and diagnostics.
Shinkawa
UTC 1000
Packaging & Bonding
The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare DS 9000 E with another model →