Waferpedia

Comparison ledger

AB 559 A 06 WedgeversusBJ 820 V 1 Wedge

ASM AB 559 A 06 Wedge, Hesse & Knipps BJ 820 V 1 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Packaging & Bonding, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
BJ 820 V 1 WedgeHesse & Knipps
OEMASMHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AB 559Hesse & Knipps BJ 820
Specifications
Configuration50/60 Hz[1]45* Bond Head[3]
Software vs2.42[2]—
Machine typeWedge Bonder[1]—
MakeASM[1]—
ModelAB 559 A 06[1]—
Frequency50/60 Hz[1]—
Voltage240 Volts[1]—
Vintage2005[1]—
Software version2.42[2]—
Bond head angle—45°[3]
Fine wire maximum—2.7 mils[3]
Software—Latest installed[3]
Detachable microscopes—Yes[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing