Thermco
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Thermco 5200 Diffusion Furnace is a diffusion furnace. Thermco 5200 Diffusion Furnace is specified for 6-inch wafers. Thermco 5200 Diffusion Furnace is configurable from two to four process chambers.[1][2]

The Thermco 5200 Diffusion Furnace is a configurable production-range system with two to four process chambers.[2]
The Thermco 5200 Diffusion Furnace is used for semiconductor substrates and related wafer-processing workloads.[2][1][3]
The Thermco 5200 Diffusion Furnace uses three independently controlled heating zones, isolated secondary-voltage power, zero-cross over full-phase SCR firing, balanced power loading, thermal safety circuits, and SCR cooling fans.[2][4]
The Thermco 5200 Diffusion Furnace can be controlled by the Thermco TMX controller and PCMUX system, with one MUX computer for recipe generation and status overview and one control computer per tube.[2][4]
The Thermco 5200 Diffusion Furnace is characterized for silicon nitride, low-stress silicon nitride, ramped-temperature polysilicon, uniform-grain polysilicon, TEOS, LTO, BPSG, high-temperature oxide, high-vacuum hydrogen anneal, dry oxide, wet oxide, POCl3 or BBr3, forming-gas anneal, high-temperature drive-in, alloy or low-temperature anneal, 100% hydrogen anneal, FGA anneal, CNT growth, and graphene growth.[2][4]
The Thermco 5200 Diffusion Furnace supports wafers up to 150 mm in diameter, and the 5200 series has a 1,100 mm flatzone.[2][4]
The Thermco 5200 Diffusion Furnace is used for processing semiconductor, PV, LED, nano, and MEMS substrates.[2][4]
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The Thermco 5200 Diffusion Furnace supports substrates up to 150 mm in diameter.[2][4]
The Thermco 5200 Diffusion Furnace is configurable from two to four process chambers.[2][4]
The Thermco 5200 Diffusion Furnace uses three independently controlled heating zones.[2][4]
The following facts about the 5200 Diffusion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 5200 Diffusion are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 5200 Diffusion are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 5200 Diffusion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 5200 Diffusion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 5200 Diffusion is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
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