Comparison ledger
CEE 1000 Hot Plate, Thermco 5200 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 5200 DiffusionThermco | |
|---|---|---|
| OEM | CEE | Thermco |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Thermco 5200 Diffusion |
| Specifications | ||
| Configuration | 4"[1] | Boron[2] |
| Type | Hot Plate[1] | — |
| Wafer Size | 4 inch[1] | — |
| Make | — | Thermco[3] |
| Model | — | 5200[3] |
| Wafer size | — | 6 inch[3] |
| Process chambers | — | Two to four-process chamber systems[4] |
| Substrate diameter | — | Up to 150 mm[4] |
| Applications | — | Semiconductor, PV, LED, Nano, and MEMS substrates[4] |
| Control system | — | Thermco TMX controller[4] |
| Heating zones | — | 3 independently controlled heating zones[4] |
| Operating temperature range | — | 200°C to 1350°C[4] |
| Flatzone | — | 1,100 mm[4] |
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