Waferpedia

MKS

660

Deposition6-inch diameter stageMKS 660 family
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The MKS 660 is a sputter deposition system for metals, alloys, and insulating thin films. The MKS 660 includes a 6-inch diameter stage. The MKS 660 supports co-sputtering and reactive sputtering.[1][2][3]

MKS660
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Wafer size

6-inch diameter stage

Power

2 RF power supplies[1]

Vacuum

cryo and turbo pumped to 1 x 10^7 Torr[1]

Optics

from a few nm to hundreds of nm[1]

What it is

The MKS 660 is a sputter deposition system for metals, alloys, and insulating thin films.[2][3]

The MKS 660 uses a six-inch diameter stage.[2][3]

How it works

The MKS 660 supports co-sputtering and reactive sputtering.[2]

The MKS 660 uses three three-inch diameter confocal cathodes, two RF power supplies, and a switchable DC power supply.[2]

Where it fits in the process flow

The MKS 660 can be used for liftoff deposition with sputter power.[2]

Applications

The MKS 660 is used for metals, alloys, and insulating thin films.[2][3]

The MKS 660 supports sputter deposition, co-sputtering, reactive sputtering, and liftoff deposition.[2]

  • sputter deposition of metals, alloys, and insulating thin films
  • liftoff deposition
  • co-sputtering
  • reactive sputtering

What do the numbers mean?

Power & electrical3

power supplies
2 RF power supplies[1]
Accurate?
DC power supply
switchable DC power supply[1]
Accurate?
Power
2 RF power supplies[2]
Accurate?

Vacuum & pumping3

vacuum system
cryo and turbo pumped to 1 x 10^7 Torr[1]
Accurate?
argon pressure range
3-15 mT controllable with 200 sccm MFC controller[1]
Accurate?
Vacuum
Cryo and turbo pumped to 1 x 10^7 Torr[1]
Accurate?

Wafer handling3

substrate rotation
+/- 10% uniformity[1]
Accurate?
substrate heating
up to 200 C[1]
Accurate?
Wafer size
6-inch diameter stage[1]
Accurate?

Optics & imaging2

film thickness range
from a few nm to hundreds of nm[1]
Accurate?
Film thickness
From a few nm to hundreds of nm[1]
Accurate?

Configuration & options6

process
sputter deposition of metals, alloys, and insulating thin films[1]
Accurate?
cathodes
three 3-inch diameter confocal cathodes[1]
Accurate?
co-sputter capability
yes[1]
Accurate?
reactive sputtering
available (Nitrogen or Oxygen)[1]
Accurate?
stage
6-inch diameter stage[1]
Accurate?
liftoff deposition
with sputter power[1]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • power supplies2 RF power supplies[1]
  • DC power supplyswitchable DC power supply[1]
  • vacuum systemcryo and turbo pumped to 1 x 10^7 Torr[1]
  • argon pressure range3-15 mT controllable with 200 sccm MFC controller[1]
  • Power2 RF power supplies[2]
  • VacuumCryo and turbo pumped to 1 x 10^7 Torr[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What materials can the MKS 660 deposit?

The MKS 660 is used for metals, alloys, and insulating thin films.[2][3]

What substrate stage does the MKS 660 use?

The MKS 660 uses a six-inch diameter stage.[2][3]

Does the MKS 660 support reactive sputtering?

The MKS 660 supports reactive sputtering with nitrogen or oxygen.[2]

What power sources are part of the MKS 660 configuration?

The MKS 660 uses two RF power supplies and a switchable DC power supply.[2]

Can the MKS 660 be used for liftoff deposition?

The MKS 660 supports liftoff deposition with sputter power.[2]

Not publicly documented

The following facts about the 660 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 660 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 660 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 660 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 660 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 660 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]MKS 660 family | Waferpedia — waferpedia.comwaferpedia.com
  4. [4]nanofab.utah.edunanofab.utah.edu
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Last updated Oct 10, 2026.

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