Comparison ledger
Denton Vacuum Discovery 18, MKS 660, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Discovery 18Denton Vacuum | 660MKS |
|---|---|---|
| OEM | Denton Vacuum | MKS |
| Category | Deposition | Deposition |
| Wafer size | 6-inch diameter stage | 6-inch diameter stage |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum Discovery | MKS 660 |
| Specifications | ||
| Deposition type | Sputter deposition of metals, alloys, and insulating thin films[1] | — |
| Film thickness range | From a few nm to hundreds of nm[1] | — |
| Cathodes | Three 3-inch diameter confocal cathodes[1] | — |
| RF power supplies | 2 RF power supplies[1] | — |
| DC power supply | Switchable DC power supply[1] | switchable DC power supply[3] |
| Co-sputter capability | Yes[1] | — |
| Reactive sputtering | Available with nitrogen or oxygen[1] | — |
| Stage diameter | 6-inch diameter stage[1] | — |
| Substrate rotation uniformity | +/- 10%[1] | — |
| Pump system | Cryo and turbo pumped[1] | — |
| Base pressure | 1 x 10^7 Torr[1] | — |
| Substrate heating | Up to 200 C[1] | — |
| Liftoff deposition | Available with sputter power[1] | — |
| Argon pressure range | 3-15 mT controllable with 200 sccm MFC controller[1] | — |
| Number of cathodes | 3[1] | — |
| Cathode diameter | 3 inches[1] | — |
| Co-sputtering capability | Yes[1] | — |
| Substrate rotation | Yes[1] | — |
| Uniformity | +/- 10%[1] | — |
| Pumping system | Cryo and turbo pumped[1] | — |
| MFC controller | 200 sccm (no APC valve)[1] | — |
| Deposition technique | Sputter deposition of metals, alloys, and insulating thin films (user configurable)[1] | — |
| Film thickness control | Controllable from a few nm to hundreds of nm[1] | — |
| Power supplies | 2 RF power supplies; switchable DC power supply[1] | — |
| Substrate stage size | 6-inch diameter stage[1] | — |
| Chamber material | 304L SS, 18" Diameter x 13.5" Deep[2] | — |
| Baseplate material | 304L SS, 20" Diameter[2] | — |
| High vacuum pump | 140 l/s Turbomolecular Pump[2] | — |
| Mechanical pump | 11 cfm[2] | — |
| Control cabinet | Single 19" Standard EIA Rack, with Single Point Power Connection[2] | — |
| High vacuum gauge | Digital Cold Cathode Auto-Ranging[2] | — |
| Control type | PLC Control of Auto Pump Sequence[2] | — |
| Feedthroughs | Baseplate (15) 1.0", (2) 2.75" Conflats, (2) 1.33" Conflats[2] | — |
| Floor space | 96" Wide x 48" Deep[2] | — |
| Chamber viewpoints | (1) 4.0" Diameter High Vacuum Valve Horizontal, 5.75" Diameter Bellows Sealed[2] | — |
| process | — | sputter deposition of metals, alloys, and insulating thin films[3] |
| film thickness range | — | from a few nm to hundreds of nm[3] |
| cathodes | — | three 3-inch diameter confocal cathodes[3] |
| power supplies | — | 2 RF power supplies[3] |
| co-sputter capability | — | yes[3] |
| reactive sputtering | — | available (Nitrogen or Oxygen)[3] |
| stage | — | 6-inch diameter stage[3] |
| substrate rotation | — | +/- 10% uniformity[3] |
| vacuum system | — | cryo and turbo pumped to 1 x 10^7 Torr[3] |
| substrate heating | — | up to 200 C[3] |
| liftoff deposition | — | with sputter power[3] |
| argon pressure range | — | 3-15 mT controllable with 200 sccm MFC controller[3] |
| Wafer size | — | 6-inch diameter stage[3] |
| Power | — | 2 RF power supplies[4] |
| Vacuum | — | Cryo and turbo pumped to 1 x 10^7 Torr[3] |
| Film thickness | — | From a few nm to hundreds of nm[3] |
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