40 NT

The EVG 40 NT is an automated measurement system for metrology in semiconductor manufacturing, specifically for lithography and bonding processes. The system enables measurement of lithography-relevant parameters such as critical dimensions, as well as bond alignment accuracy. The EVG 40 NT is available as a stand-alone tool and as an integrated module called the AVM (HVM-integrated module).^[1][2]

The EVG 40 NT uses a top- to bottom-side microscope configuration to perform a range of measurement tasks. The system is controlled by PC-based measurement and pattern recognition software for automated analysis of alignment and dimensional data. A specialized calibration routine supports high throughput. The system employs diverse measurement methods including critical dimension (CD) measurement, die-to-die alignment verification, and multi-layer thickness measurement.^[1]

The EVG 40 NT is used after key process steps such as lithography exposure or wafer bonding to verify pattern fidelity and alignment accuracy. The system serves as a tool of record for confirming bond overlay accuracy in aligned wafer bonding, often completing the metrology loop for automated fusion bonding systems. Measurements from the tool can be used to instantly optimize integrated process parameters via an active feedback loop.^[1]

The EVG 40 NT is applied to nanoimprint lithography, where it measures critical dimensions and alignment. In wafer-to-wafer bonding, it verifies bond overlay accuracy and alignment between wafers. Other applications include critical dimension (CD) measurement, die-to-die alignment verification, and multi-layer thickness measurement. The system adapts to manufacturing processes such as nanoimprint lithography and wafer-to-wafer bonding simultaneously.^[1]