Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 40 NT, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 40 NTEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 40 |
| Specifications | ||
| Configuration | — | 50/60 Hz[1] |
| Voltage | — | 230 V[1] |
| Product type | — | Automated Measurement System[2] |
| Tool format | — | stand-alone tool[2] |
| Integrated module | — | AVM (HVM-integrated module)[2] |
| Measurement scope | — | lithography-relevant parameters and bond alignment accuracy[2] |
| Measurement methods | — | critical dimension measurement, die-to-die alignment verification, multi-layer thickness measurement[2] |
| Application examples | — | nanoimprint lithography and wafer-to-wafer bonding[2] |
| Verification capability | — | 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system[2] |
| Microscope configuration | — | top- to bottom-side microscope[2] |
| Software | — | PC-based measurement and pattern recognition software[2] |
| Throughput support | — | specialized calibration routine[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →