Disco
DGP 8761 DFM 2800 Back
Wafer size
2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier
Power
200 VAC[1]
Vacuum
Pedestal style with vacuum[2]
What it is
How it works
General reference — not yet source-verifiedA back grinder reduces wafer thickness by removing material from the rear side of a wafer.
A back grinding tool typically uses a wafer holding stage, rotating grinding spindles or wheels, and handling hardware to position the wafer for backside material removal.
Where it fits in the process flow
General reference — not yet source-verifiedA back grinder belongs in the wafer thinning flow after frontside device processing has advanced far enough to require backside material removal.
A back grinder commonly sits before downstream operations that benefit from a thinner wafer, such as singulation, die attach, or other assembly steps.
Applications
General reference — not yet source-verifiedA back grinding system is used for wafer thinning in semiconductor manufacturing.
A back grinding system is used when backside preparation, thickness reduction, or post-grind surface conditioning is needed on wafers.
What do the numbers mean?
Power & electrical3
Vacuum & pumping4
Wafer handling15
- Wafer size
- Wafer alignment system with capability for notch detection and precise alignment[2]
- Chuck cleaning system[2]
- Independent transfer arms (2) - to move wafers & form processing section[2]
- Wafer alignment system
- Wafer alignment system with capability for notch detection and precise alignment[2]
Configuration & options18
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DGP 8761 DFM 2800 Back are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8761 DFM 2800 Back are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8761 DFM 2800 Back are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8761 DFM 2800 Back are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8761 DFM 2800 Back are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8761 DFM 2800 Back is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]Equipment inventory listing
Last updated Sep 29, 2026.
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