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Comparison ledger

20 36 SurfaceversusDGP 8761 DFM 2800 Back

Blanchard 20 36 Surface, Disco DGP 8761 DFM 2800 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DGP 8761
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]Pedestal style with vacuum[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Voltage—200 VAC[2]
Phase—3 Phase[2]
Full Load Current—72 A[2]
Wafer size—2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier[3]
OEM—Disco[2]
Model—DGP 8761 / DFM 2800[2]
Equipment type—Back Grinder[2]
Loadports—2 independent loadports[3]
Carrier—25 wafer front opening unified pod (FOUP) carrier[3]
Wafer handling robot—Wafer handling robot[3]
Wafer alignment system—Wafer alignment system with capability for notch detection and precise alignment[3]
Vacuum style—Pedestal style with vacuum[3]
Wafer ID reader—Included[3]
Chuck cleaning system—Included[3]
Porous vacuum chucks—4[3]
Independent transfer arms—2[3]
Wet grind spindles—2 independent wet grind spindles[3]
Dry polish spindle—Included[3]
Grind wheels—2[3]
Polishing wheel—Included[3]
Spin-dry station—Included[3]
Tape-side wash—For clean post grind[3]
Power—200 VAC, 3 Phase[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing