Disco
DFG 840 Automatic
What it is
How it works
General reference — not yet source-verifiedA dicing and grinding machine prepares semiconductor wafers by removing material and dividing processed substrates into smaller units. A grinder in this class uses controlled wafer motion, a rotating abrasive element, and mechanical alignment features to reduce thickness and shape the wafer surface.
What do the numbers mean?
Power & electrical5
Wafer handling1
Configuration & options7
- Pure Boyd PBH 100 Oil Mist Filtration System[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What blade types are commonly used in dicing saws?General reference — not yet source-verified
Blades for dicing saws are typically categorized by the bonding material (metal, resinoid, or electroplated) and the diamond grit size. The choice depends on the material being cut and the required kerf width and cut quality.
How does the automatic alignment system work?General reference — not yet source-verified
Automatic alignment uses an optical microscope and camera to image alignment marks or die edges on the wafer. The system calculates offsets and corrects the cutting path to compensate for wafer expansion, tape stretch, or misalignment.
What factors affect dicing throughput?General reference — not yet source-verified
Throughput depends on blade speed, feed rate, step index length, and the number of cuts per die. Machine parameters are set based on die size, material hardness, and required cut quality.
How is coolant used in the dicing process?General reference — not yet source-verified
Deionized water is typically used as coolant to dissipate heat from the cut zone, lubricate the blade, and flush away silicon debris. The water flow rate and nozzle position are optimized to prevent chipping and maintain cut quality.
Not publicly documented
The following facts about the DFG 840 Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 840 Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 840 Automatic are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 840 Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 840 Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 840 Automatic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]Disco DFG 840 Automatic vs Disco Dicing comparison | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 9, 2026.
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