Tool family
Disco DFG
Models in this family
The Disco DFG 840 Automatic is a grinder with an 8-inch wafer size.
The Disco DFG 850 is a back grinder for semiconductor wafer thinning.
The Disco DFG 8560 is a dicing and grinding system for semiconductor wafer processing, used in backend assembly for singulation and thinning.
The Disco DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper is a CMP-class wafer surface conditioning machine. Machines of this class are used to planarize, thin, or finish semiconductor wafers by controlled abrasive or polishing action.
The Disco DFG 8830 is a wafer grinder for semiconductor wafers with a maximum workpiece size of 150 mm (6 inch), four spindles, and five work stations.
All entries
- DFG 840 AutomaticDisco
The Disco DFG 840 Automatic is a grinder with an 8-inch wafer size.
CategoryDicing & Grinding13 specs - DFG 850 BackDisco
The Disco DFG 850 is a back grinder for semiconductor wafer thinning.
CategoryDicing & Grinding8 specs - DFG 8540 BackDiscoCategoryDicing & Grinding5 specs
- DFG 8560Disco
General referenceThe Disco DFG 8560 is a dicing and grinding system for semiconductor wafer processing, used in backend assembly for singulation and thinning.
CategoryDicing & Grinding34 specs - DFG 8760 DFM 2700 In-Line Wafer Grinder LapperDisco
General referenceThe Disco DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper is a CMP-class wafer surface conditioning machine. Machines of this class are used to planarize, thin, or finish semiconductor wafers by controlled abrasive or polishing action.
CategoryCMP16 specs - DFG 8830Disco
The Disco DFG 8830 is a wafer grinder for semiconductor wafers with a maximum workpiece size of 150 mm (6 inch), four spindles, and five work stations.
CategoryDicing & Grinding24 specs