Disco
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Power
1.2 kW at 60,000 min⁻¹[1]
Vacuum
0.5 to 0.8 MPa[1]
Performance
0.003 mm/310 (single error), ≤0.002 mm/5[1]
Optics
0.00005 mm[1]
The Disco DFD 6361 is a fully automatic dicing saw designed for precision cutting of semiconductor wafers.[2][3][1][4]
The DFD 6361 is a dicing saw that handles wafer sizes up to 300 mm in diameter.[3][1][4]
The machine weighs approximately 2,050 kg without a transformer for overseas use and approximately 2,150 kg with such a transformer.[1][4]
The DFD 6361 uses a facing dual-spindle design with two spindles to enhance throughput.[3][1][4]
The machine reduces the distance between the blades to manage total cut time.[3][1][4]
High-magnification microscopes are standard on both Z axes, and non-contact setup sensors are an option, to reduce non-dicing sequence time.[3][1][4]
The DFD 6361 employs a Synchro Spindle with superior radial rigidity for consistent cut quality.[3][1][4]
An optional atomizing nozzle cleaning mechanism can be installed in the spinner unit to clean wafers after dicing.[3][1][4]
A cutting water flow rate control feature allows the flow rate to be managed on the screen.[3]
The DFD 6361 has an adjustable LCD touch screen with a graphical user interface.[3][4]
The machine uses a bridge-type frame structure and an improved wafer handling system for a compact footprint.[3][1][4]
A standard spindle option has a power rating of 1.2 kW and a rotation speed range of 6,000 to 60,000 min-1.[3][1][4]
Optional 1.8 kW and 2.2 kW spindles with a center thrust design are available for processing high-load materials such as glass and ceramics.[3][1][4]
A condition monitor relays processing status and key equipment information in real time.[3][1][4]
The X-axis cutting range is 310 mm, and the Y1 and Y2 axes each have a cutting range of 310 mm.[3][1][4]
The Z-axis maximum stroke is 14.7 mm for a 2-inch blade or 14.9 mm for a 3-inch blade.[3][1][4]
The workpiece flow begins with a frame pick arm moving the workpiece from a cassette to a pre-alignment stage.[3][1][4]
After centering, a lower arm moves the workpiece to a chuck table for cutting.[3][1][4]
Following cutting, an upper arm moves the workpiece to a spinner table for cleaning and drying.[3][1][4]
A lower arm then returns the workpiece to the pre-alignment stage, and the frame pick arm returns it to the cassette.[3][1][4]
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The standard spindle is a 1.2 kW unit. Optional spindles include a 1.8 kW spindle (for 2-inch blades) and a 2.2 kW spindle (for 3-inch blades), both with a center thrust design for extra rigidity.[3][1][4]
The machine dimensions are 1,200 mm (width) by 1,550 mm (depth) by 1,800 mm (height). The weight is approximately 2,050 kg without a transformer.[3][1][4]
Throughput is enhanced in two ways: the facing dual-spindle design and reduced distance between blades cut total processing time, and standard high-magnification microscopes plus optional non-contact setup sensors for both Z1 and Z2 reduce non-dicing sequence time.[3][1][4]
The following facts about the DFD 6361 Fully Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6361 Fully Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6361 Fully Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6361 Fully Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6361 Fully Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6361 Fully Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 26, 2026.
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