Comparison ledger
Rudolph E25, Sonoscan Gen-6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | E25Rudolph | Gen-6Sonoscan |
|---|---|---|
| OEM | Rudolph | Sonoscan |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | 2006– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | new generation |
| Family | Rudolph E25 | Sonoscan Gen-6 |
| Specifications | ||
| Inspection type | Automated wafer edge top and edge normal inspection[1] | — |
| Throughput | Greater than 80 WPH[1] | — |
| Wafer size | 300 mm[1] | — |
| Certification | Class 1 certified[1] | — |
| Set-up time | Approximately 10 minutes to be fully optimized and production ready[1] | — |
| Defect imaging | On-the-fly color defect image capture[1] | — |
| Detection and classification | Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel[1] | — |
| Illumination | Brightfield and darkfield illumination available[1] | — |
| Defect detection and classification | Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel[2] | — |
| Technology | — | PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions capable of single and multi-focus imaging[3] |
| Gates per channel | — | Up to 100 gates per channel[3] |
| Sampling rate | — | 2 Gsps[3] |
| Scanner | — | Inertially Balanced Linear Motor Scanner[3] |
| Scan reference platform | — | Tower-mounted scan reference platform and sample fixture[3] |
| Scanning area | — | Open-access scanning area[3] |
| Scan capacity | — | Capable of scanning JEDEC trays or a 300mm wafer[3] |
| Temperature control | — | Water recirculation and optional inline temperature control[3] |
| Analysis software | — | SonoSimulator for simplified analysis of stacked die parts[3] |
| Data analysis | — | Digital Image Analysis (DIA) quantifies acoustic data and supports automatic accept/reject criteria[3] |
| Rescanning | — | Virtual Rescanning Mode (VRM) stores comprehensive data for complete analysis after the sample is no longer available[3] |
| Instrument type | — | C-mode Scanning Acoustic Microscope[3] |
| Wafer size capability | — | 300mm wafer[3] |
| Control software operating system | — | Windows 7 Ultimate[3] |
| Scanner type | — | Inertially Balanced Linear Motor Scanner[3] |
| Cooling / fluid handling | — | Water recirculation and optional inline temperature control[3] |
| Software analysis tools | — | SonoSimulator, Digital Image Analysis (DIA), and Virtual Rescanning Mode (VRM)[3] |
| Optional imaging mode | — | Frequency Domain Imaging (FDI)[3] |
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