Waferpedia

Comparison ledger

PWM30versus1088

Headway PWM30, Heller 1088, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
PWM30Headway
1088Heller
OEMHeadwayHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeadway PWM30Heller 1088
Specifications
TypePhotoresist spin/bake hood[1]—
Spin speed50-10,000 RPM[1]—
ControlMicroprocessor controlled[1]—
Recipe stepsSupports up to nine steps in one recipe[1]—
Recipe storageStores up to 10 user-designed recipes[1]—
User interfaceLCD interface for user input prompts and process display[1]—
Substrate supportVacuum hold down chucks for alternate substrate sizes[1]—
SafetyFail-safe vacuum interlocks[1]—
ExhaustBowl exhaust[1]—
BowlRemovable bowl liners[1]—
BrakingAutomatic dynamic breaking[1]—
Heating Zones—8 zones (4 top and 4 below) plus 1 cooling zone[2]
Heating Method—Forced convection[2]
Conveyor Width—18 inches (45 cm)[2]
Heated Length—43.5 inches (111 cm)[2]
Overall Length—96 inches (244 cm)[2]
Height—50 inches (127 cm)[2]
Net Weight—900 lbs (409 kg)[2]
Thermal Profiler—Included[2]
Oven Top—Counter balance for easy access to conveyor[2]
Solder Compatibility—Lead-free and leaded soldering[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]nanocenter.umd.edunanocenter.umd.edu
  2. [2]smtdevices.comsmtdevices.com