Comparison ledger
EV Group 40 NT, EV Group 40 Top-to-Bottom Side Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 40 NTEV Group | |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Packaging & Bonding | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 40 | EV Group 40 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 50/60 Hz[2] | 50/60 Hz[4] |
| Voltage | 230 V[2] | 120-230 V[4] |
| Product type | Automated Measurement System[3] | — |
| Tool format | stand-alone tool[3] | — |
| Integrated module | AVM (HVM-integrated module)[3] | — |
| Measurement scope | lithography-relevant parameters and bond alignment accuracy[3] | — |
| Measurement methods | critical dimension measurement, die-to-die alignment verification, multi-layer thickness measurement[3] | — |
| Application examples | nanoimprint lithography and wafer-to-wafer bonding[3] | — |
| Verification capability | 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system[3] | — |
| Microscope configuration | top- to bottom-side microscope[3] | — |
| Software | PC-based measurement and pattern recognition software[3] | — |
| Throughput support | specialized calibration routine[3] | — |
| Manual Alignment Stage | — | Yes[4] |
| PC-based Measurement System | — | Yes[4] |
| Frequency | — | 50/60 Hz[4] |
| Wafer Sizes | — | 2, 3, 4, 5, 6, 8 inch (up to 200 mm)[4] |
| Vintage | — | 2002[4] |
| Measurement Type | — | Destruction-free alignment accuracy[1] |
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