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101-149-053 Gold Boosterversus540

Branson 101-149-053 Gold Booster, EV Group 540, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
540EV Group
OEMBransonEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterEV Group 540
Specifications
Configuration1:1.5[1]Anodic bond, fusion bond, adhesive bond[4]
ManufacturerBranson[2]—
Model101-149-053[2]—
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Wafer sizes—6, 8 inch[4]
Maximum substrate size—300 mm[5]
Bond force—up to 350 kN[5]
Bonding types—Anodic bond, fusion bond, adhesive bond[4]
Automation—Semi automatic (4 stations) / Fully automated single-chamber[6]
Bond tools included—(4x) 8" tools, (4x) 6" tools, (1x) 4" tool[4]
Maximum bond chambers—1[5]
Compatible alignment systems—SmartView and MBA300[5]
Maximum heater size—300 mm[5]
Loading chamber—2-axis robot[5]
Max. bond chambers—1[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]evgroup.comevgroup.com
  6. [6]waferpedia.comwaferpedia.com