EV Group
540
The EVG 540 is a wafer bonding system from EV Group. The EVG 540 supports anodic, fusion, and adhesive bonding. The EVG 540 can handle wafer sizes of 6 and 8 inches, with tools for 4 inch also available, and can process substrates up to 300 mm.[1][2]
What it is
How it works
Where it fits in the process flow
The EVG 540 is positioned for pilot-line manufacturing and research and development for high-volume manufacturing in wafer-level packaging, 3D interconnect, and MEMS applications.[2]
Applications
What do the numbers mean?
Wafer handling3
Performance1
Configuration & options13
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the EVG 540 support?
The EVG 540 handles wafer sizes of six inches and eight inches, with a maximum substrate size of 300 mm. A four-inch tool is also available.[1][2]
What bonding modes are available on the EVG 540?
The EVG 540 supports anodic bonding, fusion bonding, and adhesive bonding.[1][2]
What is the maximum bond force of the EVG 540?
The EVG 540 can apply a bond force of up to 350 kN.[2]
Which alignment systems are compatible with the EVG 540?
The EVG 540 is compatible with SmartView and MBA300 alignment systems.[2]
How many bond chambers does the EVG 540 have?
The EVG 540 has a maximum of one bond chamber.[2]
Not publicly documented
The following facts about the 540 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 540 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 540 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 540 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 540 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 540 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]evgroup.com — evgroup.comevgroup.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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