Waferpedia

Comparison ledger

321versusDFD 6362

Disco 321, Disco DFD 6362, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 321Disco DFD 6362
Specifications
OEMDisco[1]—
Model321[1]—
Equipment typeWafer Dicing Saw[1]—
Facility contextCleanroom Instrumentation[1]—
Application areaNano and Micro Fabrication[1]—
LocationFNT 4.106[1]—
Wafer SizeUp to 6 inches[2]—
Spindle Power1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3]—
Spindle Power (alternate)1500 Watt spindle[2]—
Non-Contact SetupNon Contact Setup[3]—
MicroscopeMicroscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3]—
Broken Blade DetectionBroken Blade Detection[3]—
Light TowerIncludes Light Tower[3]—
Chuck Type6" Universal Chuck (or 6" Porous Film Frame Chuck)[2]—
Wafer size capabilityUp to 6" wafers[3]—
Chuck6-inch porous film frame chuck[2]—
Spindle power1500-watt spindle[2]—
FootprintSmall footprint[2]—
SetupNon-contact setup[3]—
Blade break detectionBroken blade detection[3]—
Other featuresFloppy drive, light tower, blade tools, manuals[3]—
Max workpiece size—Φ300 mm[4]
X-axis cutting range—310 mm[4]
Cutting speed—0.1 – 1000 mm/s[4]
Y1/Y2 cutting range—310 mm[4]
Index step—0.0001 mm[4]
Positioning accuracy (X axis)—Within 0.002 mm / 310 mm (Single error)[4]
Z-axis max stroke—14.7 mm (for Φ2 inch blade); 14.9 mm (for Φ3 inch blade)[4]
θ-axis max rotating angle—380 deg[4]
Spindle rated torque (1.2 kW / high-speed rotation)—0.19 N·m[4]
Spindle rotation speed range (1.2 kW / 1.8 kW)—6,000 – 60,000 min⁻¹[4]
Spindle rotation speed range (high-speed rotation)—20,000 – 80,000 min⁻¹[4]
Equipment dimensions (W×D×H)—1,200 × 1,550 × 1,800 mm[4]
Equipment weight—Approx. 2,050 kg[4]
Power supply phase—3 Phase[5]
Power frequency—50/60 Hz[5]
Voltage range—308 – 415 VAC ±10%, 3 Phase[5]
Full load current—9 A[5]
Machine main breaker rating—20 A[5]
Standard spindle power—1.2 kW[6]
Optional spindle powers—1.8 kW or 2.2 kW[6]
Wafer size—300 mm[6]
Vintage—2010[6]
Serial number—NL1049[6]
Cassette type—Dual-stack cassette handler for 300 mm[6]
BCR system—Yes[6]
Touch screen display—Yes[6]
Automatic wheel covers—Yes[6]
Air ionizer—Yes[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]jmind.comjmind.com
  3. [3]gtsaz.comgtsaz.com
  4. [4]disco.com.sgdisco.com.sg
  5. [5]waferpedia.comwaferpedia.com
  6. [6]agsemiconductor.comagsemiconductor.com