Waferpedia

Comparison ledger

1000 Hot PlateversusPWM30

CEE 1000 Hot Plate, Headway PWM30, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
PWM30Headway
OEMCEEHeadway
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateHeadway PWM30
Specifications
Configuration4"[1]—
TypeHot Plate[1]Photoresist spin/bake hood[2]
Wafer Size4 inch[1]—
Spin speed—50-10,000 RPM[2]
Control—Microprocessor controlled[2]
Recipe steps—Supports up to nine steps in one recipe[2]
Recipe storage—Stores up to 10 user-designed recipes[2]
User interface—LCD interface for user input prompts and process display[2]
Substrate support—Vacuum hold down chucks for alternate substrate sizes[2]
Safety—Fail-safe vacuum interlocks[2]
Exhaust—Bowl exhaust[2]
Bowl—Removable bowl liners[2]
Braking—Automatic dynamic breaking[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanocenter.umd.edunanocenter.umd.edu