Waferpedia

Comparison ledger

Rtespa 300versus11000

Bruker Rtespa 300, Cascade Microtech 11000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11000Cascade Microtech
OEMBrukerCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBruker Rtespa 300Cascade Microtech 11000
Specifications
ModelRtespa 300[1]—
Equipment typeProber[1]—
Probe geometryRectangular[2]—
Frequency, nominal300 kHz[2]—
Frequency range200 to 400 kHz[2]—
Spring constant, nominal40 N/m[2]—
Spring constant range20 to 80 N/m[2]—
Length, nominal125 µm[2]—
Length range115 to 135 µm[2]—
Width, nominal40 µm[2]—
Width range38 to 42 µm[2]—
Tip radius, nominal8 nm[2]—
Tip radius, max12 nm[2]—
Tip height10 to 15 µm[2]—
Front angle15 ± 2°[2]—
Back angle25 ± 2°[2]—
Side angle17.5 ± 2°[2]—
Cantilever material0.01 to 0.025 Ωcm antimony (n) doped Si[2]—
Cantilever thickness, nominal3.4 µm[2]—
Cantilever thickness range2.65 to 4.15 µm[2]—
Back side coatingReflective aluminum[2]—
Configuration—With antivibration table[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]brukerafmprobes.combrukerafmprobes.com
  3. [3]inventory listing
  4. [4]inventory listing