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0010-22161 High EFF RF MatchversusScientific FEI Helios NanoLab 600 FIB

Applied Materials 0010-22161 High EFF RF Match, Thermo Fisher Scientific FEI Helios NanoLab 600 FIB, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsThermo Fisher
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
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FamilyApplied Materials 0010-22161 High EFF RF MatchThermo Fisher Scientific FEI Helios NanoLab 600 FIB
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Configuration—Dual beam[3]
Sample stage—5-Axes motorized X-Y-Z-rotate-tilt stage[3]
Step size—100 nm (Minimum)[3]
High vacuum—10^-10 mbar[3]
X, Y-Axis—150 mm[3]
Z-Axis—10 mm[3]
Tilt range—-5° to +60°[3]
Source—SCHOTTKY Field emitter[3]
Accelerating voltage—350 V to 30 kV (Continuously adjustable)[3]
Beam current—1 pA - 22 nA[3]
Type—Dual beam[3]
Vacuum system—Edwards XDS10 Scroll pump[3]
Travel X, Y-Axis—150 mm[3]
Travel Z-Axis—10 mm[3]
Repeatability—1 µm at 0°; 2 µ at 52°[3]
Electron source—SCHOTTKY Field emitter[3]
Electron accelerating voltage—350 V to 30 kV (Continuously adjustable)[3]
Electron beam current—1 pA - 22 nA[3]
Electron resolution—0.9 nm at 15 kV; 1.4 nm at 1 kV[3]
Ion source—Liquid Gallium ion emitter[3]
Ion optics—Sidewinder Field emission focused ion beam optics[3]
Ion accelerating voltage—0.5 kV to 30 kV (Continuously adjustable)[3]
Ion beam current—1.5 pA - 20 nA[3]
Ion imaging resolution—5 nm at 30 kV[3]
Ion milling resolution—10 nn on Cr thin film[3]
Scanner resolutions—512x442, 1024x884, 2048x1768, 4096x3536 pixels[3]
Minimum dwell time—25 ns/pixel[3]
Patterning maximum resolution—64k x 64k[3]
Patterning maximum dwell—25 ms/pixel[3]
Detectors—In-lens SE and BSE True Lens Detector (TLD); Everhart-Thornely SE Detector (ETD); 14-Segments solid state STEM II detector; Chamber viewing IR CCD camera[3]
Controller—Microscope controller; LCD Monitor, 19"; Screen resolution 1280x1024; Optical mouse; Chamber door mounted interface for manipulators[3]
Imaging resolution—5 nm at 30 kV[3]
Milling resolution—10 nn on Cr thin film[3]
Resolution—512x442, 1024x884, 2048x1768, 4096x3536 pixels[3]
Maximum resolution—64k x 64k[3]
Minimum dwell—25 ns/pixel[3]
Maximum dwell—25 ms/pixel[3]
Screen resolution—1280x1024[3]
Instrument type—Dual beam focused ion beam (FIB)[3]
Stage—5-axis motorized X-Y-Z-rotate-tilt stage[3]
Stage travel X/Y—150 mm[5]
Stage travel Z—10 mm[3]
Vacuum pump—Edwards XDS10 scroll pump[3]
Sample stage step size—100 nm minimum[3]
Maximum dwell time—25 ms/pixel[3]
Additional included item—Broad beam plasma source ion column (focus 250 µm)[3]
Included documentation—Manuals included[3]
Manipulator—Does not include manipulator[3]
Stage control—5 axes motorized XYZRT 6 in UHR stage with piezo control[5]
Magnification—69x to 2,300,000x[5]
Detector—Through-lens detection for SE and BSE[5]
STEM detector—Retractable[5]
Stage tilt—-10° to +60°[5]
Optional accessories—Omniprobe Autoprobe 200; Ibss Group GV10x plasma cleaner[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]waferpedia.comwaferpedia.com