Waferpedia

Comparison ledger

0010-21246 PartversusAlignment

Applied Materials 0010-21246 Part, SUSS MicroTec Alignment, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
AlignmentSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—SUSS MicroTec Alignment
Cited variants—
  • MA300 Gen3Gen3[1]
  • MA200 Gen3Gen3[1]
  • MA12 Gen3Gen3[1]
  • MJB4[1]
  • MA/BA Gen4 SeriesGen4[1]
Specifications
Manufacturer—SUSS MicroTec[2]
Asset name—SUSS Alignment Tool[3]
Product family—Mask Alignment[1]
Substrate size—Up to 300 mm[1]
Alignment mode—Mask-to-wafer and wafer-to-wafer alignment[1]
Integrated metrology—Wafer prealignment and notch detection[1]
Topside alignment—Supported[4]
Backside alignment—Supported[4]
Substrate diameter range—1" to 150 mm diameter[4]
Mask size range—2.5" x 2.5" to 7" x 7"[4]
Maximum substrate thickness—10 mm[4]
Resist compatibility—For use with i-line resists[4]
Model—Alignment[3]
Tool type—Mask alignment[1]
Supported substrate size—up to 300 mm[1]
Alignment modes—mask-to-wafer and wafer-to-wafer alignment[1]
Alignment optics—precision optics[1]
Related system—MA/BA6 Mask Alignment System[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]suss.comsuss.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]nff.gmu.edunff.gmu.edu