YES
8-2P-CP
The YES 8-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications. The YES 8-2P-CP is specified for 200 mm wafers. The YES 8-2P-CP is used for polyimide/PBO cure, BCB bake, low temp polymers cure, copper anneal, low-K dielectric cure, copper oxide removal, and aluminum anneal.[1][2]
What it is
How it works
Where it fits in the process flow
Applications
The YES 8-2P-CP is used for polyimide and PBO cure, BCB bake, low-temperature polymer cure, copper anneal, low-k dielectric cure, copper oxide removal, and aluminum anneal.[1][2]
- Polyimide/PBO cure
- BCB bake
- Low temp polymers cure
- Copper anneal
- Low-K dielectric cure
- Copper oxide removal
- Aluminum anneal
- WLP/RDL applications
- MEMS and semiconductor process applications
What do the numbers mean?
Wafer handling1
Control & software2
Configuration & options8
- Applications
- Polyimide/PBO cure; BCB bake; Low temp polymers cure; Copper anneal; Low-K dielectric cure; Copper oxide removal; Aluminum anneal[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| YES 6-2P-CP | — | — | Listed as a different wafer-size configuration in the same PB Series overview; stated for 150 mm wafers. | web.archive.org[3] |
| YES 12-2P-CP | — | — | Listed as a different wafer-size configuration in the same PB Series overview; stated for 300 mm wafers. | web.archive.org[3] |
| YES 8-2P-CP | — | — | Specified for 200 mm wafers. | web.archive.org[3] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of processes can be performed in a diffusion furnace of this class?General reference — not yet source-verified
Common processes include thermal oxidation (wet and dry), dopant diffusion (predeposition and drive-in), and low-pressure chemical vapor deposition (LPCVD) of films like silicon nitride, silicon dioxide, or polysilicon. Some furnaces also support in-situ steam generation or rapid thermal processing.
How is temperature uniformity maintained in the furnace tube?General reference — not yet source-verified
Temperature uniformity is achieved by using multiple heating zones (typically three to five zones) along the tube length, each with independent controllers. Thermocouples feedback to the system to maintain a flat temperature profile across the wafer boat. Profile tuning is done via calibration runs with instrumented wafers.
What are the typical wafer handling and loading methods?General reference — not yet source-verified
Wafers are loaded into quartz boats that are manually or automatically inserted into the furnace tube. Manual loading is common for older machines, while more modern versions may use automated paddle systems. The boat is positioned at a specific location to ensure all wafers experience the same thermal environment.
Not publicly documented
The following facts about the 8-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8-2P-CP are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 8-2P-CP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8-2P-CP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8-2P-CP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8-2P-CP are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]Manual-Load High-Temperature Cure Ovens for MEMS & Semiconductor Process Applications — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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