West Bond
7700E Series
The West Bond 7700E Series is a manual ball-wedge wire bonder. The West Bond 7700E Series is designed to interconnect wire leads to semiconductor, hybrid, or microwave devices. The West Bond 7700E Series bonds gold wires ranging from 0.0007 inches.[1]
Plate 01Westbond 7700E
glenpacheco2414Watch on YouTubePlate 02West Bond 7700E-79C Bonder with BL4 #59255
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What it is
How it works
Where it fits in the process flow
The 7700E is used after device fabrication and before downstream package assembly completion, when fine wire interconnection is required on semiconductor, hybrid, or microwave devices.[1]
Applications
The 7700E is intended for bonding gold wire.[1]
The 7700E is intended for interconnecting wire leads on semiconductor, hybrid, and microwave devices.[1]
- Bonding wire leads to semiconductor devices
- Bonding wire leads to hybrid devices
- Bonding wire leads to microwave devices
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Poor bond quality may mean a bond does not meet visual criteria, does not adhere to the bonding surface, or produces unacceptable bond pull tests.
What do the numbers mean?
Configuration & options14
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 7476E | — | — | Single wedge bond tool head with angled clamp assembly and overhead clamp assembly for bonding by either wedge method. | manualslib.com[1] |
What replaced it?
Related models
- siblingWest Bond 7476E— Defined as a complete stand-alone model of the same series.source[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding mode does the 7700E Series use?
The 7700E Series is a manual ball-wedge wire bonder.[1]
What device types can the 7700E interconnect?
The 7700E is designed to interconnect wire leads to semiconductor, hybrid, or microwave devices.[1]
How does the 7700E form balls at the wire tip?
The 7700E feeds an exact new length of wire and discharges a controlled quantity of electrical energy to the free wire end.[1]
What machine feature tracks vertical tool motion during ball formation?
An optical encoder built into the Z axis tracks the vertical tool motion.[1]
Not publicly documented
The following facts about the 7700E Series are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7700E Series are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 7700E Series are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 7700E Series is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 7700E Series are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 7700E Series are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]manualslib.com — manualslib.commanualslib.com
Last updated Oct 2, 2026.
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