Waferpedia

West Bond

7614

Packaging & BondingWest Bond 7614 family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

West Bond7614
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What it is

The West-Bond 7614 is a wire bonder in the West-Bond equipment family.[1]

How it works

General reference — not yet source-verified

A wire bonder positions a bonding head over a target pad and forms a bond by applying mechanical force together with thermal, ultrasonic, or thermosonic energy, depending on the bonding method used by the machine.

Wire bonding equipment is used to connect die pads to leadframes, substrates, or other interconnect structures by repeating a bond formation sequence at each pad location.

Where it fits in the process flow

General reference — not yet source-verified

The West-Bond 7614 belongs in the semiconductor packaging flow after wafer fabrication and die singulation, where it is used during assembly to make electrical connections for packaged devices.

Wire bonding is a downstream interconnect step that follows die placement and precedes encapsulation or other final package completion steps.

Applications

The West-Bond 7614 is part of a family that includes wire bonders used for semiconductor packaging and bonding work.[1]

What do the numbers mean?

Configuration & options2

Equipment type
Wire bonder[1]
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Model listing
West-Bond 7614[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the West-Bond 7614?

The West-Bond 7614 is a wire bonder.[1]

Not publicly documented

The following facts about the 7614 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the 7614 are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7614 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7614 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7614 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7614 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
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Last updated Oct 4, 2026.

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