747677B

Convertible wire bonders allow operators to swap bond heads in order to perform different bonding processes on a single machine platform. The gold ball bond head supports thermosonic ball bonding, a process that uses ultrasonic energy, heat, and pressure to form gold ball bonds between the wire and the bond pad.

Wire bonders create electrical interconnections by feeding wire through a bonding tool. A convertible bonder can accept interchangeable bond heads—for example, a ball bond head or a wedge bond head—each designed for a specific bonding method. In thermosonic ball bonding, a gold ball is formed at the tip of the wire by an electronic flame-off or hydrogen flame, then the ball is pressed onto the heated bond pad while ultrasonic vibration and force are applied.

The operator typically positions the bond head using a manual or semi-automatic XY stage and views the work through a microscope. Convertible machines give a single station the flexibility to handle multiple package types and wire materials without dedicated equipment.

Wire bonding is a backend semiconductor assembly step performed after die attach and before encapsulation. The West Bond 747677B would be used in a packaging line to connect bond pads on the semiconductor die to the leads or pads of a package substrate such as a leadframe, ceramic package, or printed circuit board.

Convertible wire bonders are used in the assembly of integrated circuits, discrete semiconductors, MEMS devices, and hybrids. The gold ball bonding capability of the 747677B makes it suitable for packages that require thermosonic ball bonding, such as those using gold wire for high-reliability connections.