Veeco
The Veeco AP 300 E Lithography System is a lithography tool. The Veeco AP 300 E Lithography System has 2.0 µm resolution. The Veeco AP 300 E Lithography System supports warped wafer handling to 500 µm.[1][2][3]
Wafer size
Warped Wafer Handling to 500 um
Power
208 V three phase, 5 wire, 150 amp[1]
Performance
PATMAX MVS Alignment System[1]
Optics
MVS Alignment Spectrum of 530 - 570 nm[1]
The system supports both two hundred millimeter and three hundred millimeter wafer sizes, and its extended-field ghi-line broadband optics enable imaging for thick photoresist layers and substrates with significant topography.[1][2]
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The AP 300 E Lithography System has 2.0 µm resolution.[1][2][3]
The AP 300 E Lithography System supports 200 mm and 300 mm wafers.[1][2]
The AP 300 E Lithography System supports warped wafer handling to 500 µm.[1][2][3]
The following facts about the AP 300 E Lithography are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AP 300 E Lithography are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AP 300 E Lithography are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AP 300 E Lithography are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AP 300 E Lithography are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AP 300 E Lithography is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.
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