Ulvac
NE 5000 N
What it is
General reference — not yet source-verifiedThe Ulvac NE 5000 N is a dry etcher used in semiconductor manufacturing to remove material from wafer surfaces through plasma-based chemical reactions.
How it works
General reference — not yet source-verifiedDry etchers in this class use a vacuum chamber where reactive gases are ionized into a plasma. The plasma generates chemically active species that react with the wafer surface, forming volatile byproducts that are pumped away.
Where it fits in the process flow
General reference — not yet source-verifiedEtch equipment is placed after lithography and before deposition or cleaning steps in a semiconductor fabrication line. The etcher transfers the photoresist pattern into the underlying layer by removing exposed material.
Upstream processes include photoresist coating and exposure; downstream steps often involve photoresist stripping and inspection. The etcher is part of the critical pattern transfer sequence.
Applications
General reference — not yet source-verifiedThe equipment can be configured for different chemistries, such as fluorine-based or chlorine-based plasmas, depending on the material to be etched.
What do the numbers mean?
Wafer handling1
Gas & chemistry2
- We can customize gas lines based on RFQ[1]
Performance2
- Uniformity can be +/- 3%[1]
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the NE 5000 N are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NE 5000 N are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NE 5000 N are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NE 5000 N are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NE 5000 N are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NE 5000 N is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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