Ulvac
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

In a semiconductor or optical coating workflow, the evaporation system is typically placed in a dedicated deposition area. Components are prepared and loaded into the system on a fixturing assembly. After loading, the chamber is sealed and pumped down by a vacuum system. Once the film has been deposited and the process is concluded, the chamber is vented and the coated substrates are removed for inspection or further processing.
High vacuum evaporation systems are used to deposit thin films of metals, alloys, and certain compounds. Typical applications for this class of equipment include the creation of reflective coatings for mirrors, conductive electrodes for electronics, and functional coatings for optical devices.
Be the first to add cited specifications for this tool.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the EBX 2000 High Vacuum Evaporation are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the EBX 2000 High Vacuum Evaporation are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EBX 2000 High Vacuum Evaporation are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EBX 2000 High Vacuum Evaporation are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EBX 2000 High Vacuum Evaporation are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EBX 2000 High Vacuum Evaporation are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Sep 26, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.
Applied Materials 0020 18455 is a part described as "Shaft, Rf In Local Match, Hdpcvd, Rev3."