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Ultratech

AP200

LithographyIntroduced Ultratech AP200 family
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UltratechAP200
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What it is

General reference — not yet source-verified

The Ultratech AP200 is a lithography tool used for photolithographic pattern transfer in semiconductor manufacturing.

The AP200 belongs to the class of mask aligners and steppers used to place circuit patterns onto a photoresist-coated substrate by controlled exposure to light.

How it works

General reference — not yet source-verified

A lithography aligner or stepper positions a mask or reticle relative to the substrate and exposes selected areas through optical imaging.

The exposure creates a latent pattern in photoresist, and later chemical processing transfers that pattern into the underlying film or wafer.

Where it fits in the process flow

General reference — not yet source-verified

Lithography sits near the front end of semiconductor process flow, after surface preparation and resist coating and before development, etching, or deposition pattern transfer steps.

The Ultratech AP200 is used when patterned exposure is needed on a substrate before the patterned features are formed in subsequent processing.

Applications

General reference — not yet source-verified

Mask aligners and steppers are used for defining patterned structures on wafers and other substrates in semiconductor and related precision microfabrication work.

Equipment of this class is also used in processes that require repeated optical patterning rather than direct mechanical contact with the feature geometry.

  • Advanced packaging (AP)
  • Bump processing (AP bump tools)

What do the numbers mean?

Configuration & options4

System type
Lithography system[1]
Accurate?
Application
Advanced packaging (AP)[1]
Accurate?
Platform
Unity Platform[1]
Accurate?
Platform introduction
Mid-2004 on AP bump tools[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the AP200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AP200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the AP200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the AP200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the AP200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the AP200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.org — en.wikipedia.orgen.wikipedia.org
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Last updated Oct 9, 2026.

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