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Teradyne

Ultra Flex RF HPC

Test & ProbeTeradyne Ultra Flex family
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The Teradyne Ultra Flex RF HPC is a Teradyne test system. The Teradyne Ultra Flex RF HPC is categorized as Test & Probe. The Teradyne Ultra Flex RF HPC has installed modules across slots 0 through 22.[1][2]

Ultra Flex RF HPC — Inventory photo
Fig. 01Ultra Flex RF HPCInventory photo[2]

Power

Ultra Flex RF HPC[2]

Vacuum

Turbo-Frame[2]

What it is

The Teradyne Ultra Flex RF HPC is a test and probe system for semiconductor testing.[2][1]

The Teradyne Ultra Flex RF HPC is a Teradyne test system with installed modules across multiple slots, including GigaDig HD 2, HDVS 1, MWMeasure, HSDI, HSS 6400, HSD-M, MWSynthRef, Turbo-Frame, DC-30, HexVS, and MWSynthLO.[2][1]

How it works

General reference — not yet source-verified

A test and probe system makes electrical contact to devices on a wafer and applies measurement signals to evaluate device behavior before singulation.

A semiconductor tester of this class commonly combines measurement, source, and switching modules so that different stimulus and response paths can be connected to the device under test.

Where it fits in the process flow

General reference — not yet source-verified

A test and probe system sits in the electrical test stage of semiconductor manufacturing, after wafer processing and before final device sorting or assembly.

The Ultra Flex RF HPC is used at wafer level, where probing supports characterization and functional screening of devices while they remain on the wafer.

Applications

General reference — not yet source-verified

A test and probe system is used for wafer-level electrical characterization, parametric testing, and functional screening of semiconductor devices.

An RF-capable test platform is suited to devices that require radio-frequency measurement, mixed-signal evaluation, and high-frequency stimulus and response handling.

What do the numbers mean?

Power & electrical1

Model
Ultra Flex RF HPC[2]
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Vacuum & pumping2

Slot 11
Turbo-Frame[2]
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Installed modules
Slot 0: GigaDig HD 2; Slot 1: HDVS 1; Slot 2: MWMeasure; Slot 3: HSDI; Slot 4: HSS 6400; Slot 6: HSD-M; Slot 7: HSD-M; Slot 8: HSD-M; Slot 9: HSD-M; Slot 10: MWSynthRef; Slot 11: Turbo-Frame; Slot 12: HSDI; Slot 13: HSDI; Slot 14: HSD-M; Slot 15: HSD-M; Slot 16: HSD-M; Slot 17: HSD-M; Slot 18: DC-30; Slot 19: HexVS; Slot 20: DC-30; Slot 21: HexVS; Slot 22: MWSynthLO[2]
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Configuration & options21

Slot 0
GigaDig HD 2[2]
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Slot 1
HDVS 1[2]
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Slot 2
MWMeasure[2]
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Slot 3
HSDI[2]
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Slot 4
HSS 6400[2]
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Slot 6
HSD-M[2]
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Slot 7
HSD-M[2]
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Slot 8
HSD-M[2]
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Slot 9
HSD-M[2]
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Slot 10
MWSynthRef[2]
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Slot 12
HSDI[2]
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Slot 13
HSDI[2]
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Slot 14
HSD-M[2]
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Slot 15
HSD-M[2]
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Slot 16
HSD-M[2]
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Slot 17
HSD-M[2]
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Slot 18
DC-30[2]
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Slot 19
HexVS[2]
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Slot 20
DC-30[2]
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Make
Teradyne[2]
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Category
Test & Probe[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Slot 11Turbo-Frame[2]
  • ModelUltra Flex RF HPC[2]
  • Installed modulesSlot 0: GigaDig HD 2; Slot 1: HDVS 1; Slot 2: MWMeasure; Slot 3: HSDI; Slot 4: HSS 6400; Slot 6: HSD-M; Slot 7: HSD-M; Slot 8: HSD-M; Slot 9: HSD-M; Slot 10: MWSynthRef; Slot 11: Turbo-Frame; Slot 12: HSDI; Slot 13: HSDI; Slot 14: HSD-M; Slot 15: HSD-M; Slot 16: HSD-M; Slot 17: HSD-M; Slot 18: DC-30; Slot 19: HexVS; Slot 20: DC-30; Slot 21: HexVS; Slot 22: MWSynthLO[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Ultra Flex RF HPC?

The Ultra Flex RF HPC is a Teradyne test and probe system for semiconductor testing.[2][1]

Not publicly documented

The following facts about the Ultra Flex RF HPC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ultra Flex RF HPC are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Ultra Flex RF HPC are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Ultra Flex RF HPC are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Ultra Flex RF HPC are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Ultra Flex RF HPC is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]Inventory photo
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Last updated Oct 5, 2026.

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