Teradyne

Spectrum 8855

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The Teradyne Spectrum 8855 is a test system. The Teradyne Spectrum 8855 includes analog test, vectorless test, digital and mixed-signal vector test, and boundary-scan test capabilities. The Teradyne Spectrum 8855 supports in-line device programming of Flash, EEPROM, and FPGAs.^[1]

Spectrum 8855 — Inventory photo — Fig. 01Spectrum 8855Inventory photo^[2]

What it is

The Teradyne Spectrum 8855 is an in-circuit test system in the Spectrum line.^[1]

The Spectrum 8855 is a semiconductor test and probe-related tester associated with in-circuit testing, analog test, vectorless test, digital and mixed-signal vector test, and boundary-scan test capabilities.^[1]

How it works

The Spectrum 8855 supports an extended VXI card cage for integration of third-party C-sized VXI instruments.^[1]

Where it fits in the process flow

The Spectrum 8855 can also support in-line programming of Flash, EEPROM, and FPGAs as part of board-level workflow.^[1]

Applications

The Spectrum 8855 supports analog test, vectorless test, digital and mixed-signal vector test, and boundary-scan test.^[1]

The Spectrum 8855 supports in-line programming of Flash, EEPROM, and FPGAs.^[1]

What do the numbers mean?

Power & electrical9

Power: 5.50v, 200.00w^[2]
Power: 24.00v, 50.00w^[2]
Power: 52.00v, 200.00w^[2]; High voltage PRISM board^[3]
5.50V power rail: 200W^[2]
24V power rail: 50W^[2]
52V power rail: 200W^[2]
Board configuration (asset 75211): High voltage PRISM board, VP board (2), CC2a master and expander board (24)^[3]
Power: 5.50v, 200.00w; 24.00v, 50.00w; 52.00v, 200.00w^[2]

Configuration & options19

Hardware scan table^[2]; VXI-MXI-2^[2]; FIB / DeltaScan board^[2]; VP board (3)^[2]; CC2a master and expander board (36)^[2]; VP board (2)^[3]; CC2a master and expander board (24)^[3]
VXI card cage: Extended for 3rd party C-sized VXI instruments^[1]
Hardware scan table: Included^[2]
VXI-MXI-2: Included^[2]
Board configuration (asset 75212): FIB/DeltaScan board, VP board (3), CC2a master and expander board (36)^[2]
Manufacturer: Teradyne^[2]
Model: Spectrum 8855^[2]
Equipment type: Tester^[2]
Hardware: Hardware scan table; VXI-MXI-2; FIB / DeltaScan board; VP board (3); CC2a master and expander board (36)^[2]
Vintage: 2005^[2]
Test capabilities: Analog test; vectorless test; digital and mixed-signal vector test; boundary-scan test^[1]
Device programming: In-line device programming of Flash, EEPROM, and FPGAs^[1]
Card cage: Extended VXI card cage for integration of 3rd party C-sized VXI instruments^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power5.50v, 200.00w^[2]
Power24.00v, 50.00w^[2]
Power52.00v, 200.00w^[2]
ConfigurationHigh voltage PRISM board^[3]
5.50V power rail200W^[2]
24V power rail50W^[2]
52V power rail200W^[2]
Board configuration (asset 75211)High voltage PRISM board, VP board (2), CC2a master and expander board (24)^[3]
Power5.50v, 200.00w; 24.00v, 50.00w; 52.00v, 200.00w^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of semiconductor devices can be tested on a system of this class?General reference — not yet source-verified

Such systems can test a wide range of devices, including digital logic, memory, mixed-signal, and some analog or RF circuits, depending on the specific configuration and instrumentation available.

Does the system require a probe card for wafer-level testing?General reference — not yet source-verified

Yes, for wafer-level probing, the test head must be mechanically aligned with a probe card that contacts the individual die on the wafer. The probe card is specific to the device pad layout.

What is the typical test flow using this class of machine?General reference — not yet source-verified

The test flow involves loading a test program, placing the device under test (DUT) in contact, executing the test sequence (functional and parametric), and then sorting or binning based on results. In production, multiple devices may be tested in parallel to improve throughput.

What maintenance is required for such a system?General reference — not yet source-verified

Routine maintenance includes cleaning probe card contacts, calibrating measurement instruments, updating test programs, and performing periodic system-level checks to ensure accuracy and repeatability.

Not publicly documented

The following facts about the Spectrum 8855 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Spectrum 8855 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Spectrum 8855 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Spectrum 8855 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Spectrum 8855 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Spectrum 8855 is not on record.
Answerable by: an OEM datasheet or a fab qualification report