Waferpedia

Teradyne

Nextest Magnum V

Test & ProbeTeradyne Nextest Magnum V family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Nextest Magnum V family includes the Magnum V EV variant, a semiconductor tester for memory devices manufactured by Teradyne/Nextest. The Magnum V EV operates on 220 V, 50/60 Hz and provides 512 test channels.[1]

Teradyne logo
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What it is

The Magnum V is a semiconductor tester manufactured by Teradyne / Nextest. The Magnum V EV is a variant of the Magnum V within the Teradyne Nextest Magnum family. The tester is assigned to the Test & Probe category of semiconductor manufacturing equipment.[3][2][1]

How it works

The Magnum V EV uses a Dell control workstation as its system controller. The Magnum V EV Test Interface Unit provides 512 channels. The Magnum V EV operates from a 220 V, 50/60 Hz electrical supply.[1]

Where it fits in the process flow

General reference — not yet source-verified

Semiconductor testers occupy two points in the manufacturing flow for integrated circuits. At wafer sort, the devices are tested while still on the wafer, before dicing and packaging. At final test, packaged devices are tested again prior to shipment. A memory tester such as the Magnum V is used in the production testing of memory devices, either as a wafer-sort prober test system or in package-level final test.

Applications

General reference — not yet source-verified

The Magnum V is a tester for memory devices such as flash memory. Flash memory is a non-volatile storage technology found in a broad range of electronic products. Testing of flash memory verifies program, erase, and read operations together with the electrical parameters that determine device performance and reliability.

What do the numbers mean?

Power & electrical2

Voltage
220 V[1]
Accurate?
Frequency
50/60 Hz[1]
Accurate?

Control & software2

Control Workstation
Dell Control Workstation[1]
Accurate?
Test Interface Unit Channels
512[1]
Accurate?

Configuration & options14

Test Instrument Unit (TIU)
522203-198 512ch TIU (2013 Vintage)[1]
Accurate?
TIU Vintage
2013[1]
Accurate?
Option Module
525419 Mag V option module (2)[1]
Accurate?
Other Modules
522408 SA HSBX DP128ER PED (2)[1]
Accurate?
Chiller
Included[1]
Accurate?
Chiller Vintage
2013[1]
Accurate?
Make
Teradyne / Nextest[2]
Accurate?
Model
Magnum V[2]
Accurate?
Asset #
133068[3]
Accurate?
Asset #
133066[2]
Accurate?
Model name
Magnum V EV[1]
Accurate?
Manufacturer
Teradyne / Nextest[1]
Accurate?
Configuration / options
522408 SA HSBX DP128ER PED (2); 525419 Mag V option module (2); chiller[1]
Accurate?
Test Instrument Unit
522203-198 512ch TIU (2013 Vintage)[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Magnum V EV——Memory tester with 512 channels, 220V power, Dell control workstation, and chiller.waferpedia.com[1]
Nextest Magnum V EV——Configured with a 512-channel TIU and Mag V option modules.waferpedia.com[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage220 V[1]
  • Frequency50/60 Hz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of devices can the Nextest Magnum V test?General reference — not yet source-verified

Like other test systems in its class, it is capable of testing a variety of semiconductor devices, including digital logic, memory, analog, and mixed-signal components, depending on the instrument configuration and test program.

Is this system suitable for wafer-level or package-level test?General reference — not yet source-verified

Systems of this class can be configured for either wafer probing (via an integrated prober) or final package testing (via a handler), making them versatile for different stages of device qualification.

What is the typical interface used to connect the DUT?General reference — not yet source-verified

The system interfaces through a probe card for wafer-level test or a test socket for packaged parts. The interface is designed to provide reliable electrical contact and high signal integrity.

Not publicly documented

The following facts about the Nextest Magnum V are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Nextest Magnum V are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Nextest Magnum V are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Nextest Magnum V are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Nextest Magnum V is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Nextest Magnum V are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
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Last updated Oct 7, 2026.

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