Shinkawa
UTC 3000
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Shinkawa UTC 3000 is a wire bonder. The Shinkawa UTC 3000 is an IC wire bonder. The Shinkawa UTC 3000 was used for thermosonic bonding.[1][2][3]
What it is
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is performed after the die is attached to the package and before encapsulation or molding. The process connects the die bond pads to the package leads or substrate traces.
Applications
The UTC 3000 was employed in an experiment to bond pure silver wire and silver alloy wire with a diameter of 20 µm for reliability testing.[3]
What do the numbers mean?
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the UTC 3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 3000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 3000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 3000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 3000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 3000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]yacdastech.com — yacdastech.comyacdastech.com
- [3]imapsource.org — imapsource.orgimapsource.org
Last updated Oct 6, 2026.
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