RECIF
The RECIF G 3 Plus Wafer is a test and probe tool. The RECIF G 3 Plus Wafer is a wafer handler and sorter for 300mm wafers.[1][2]

A wafer sorter in this class typically uses automated handling to route wafers or wafer carriers through loading, transfer, and unloading steps.
A test and probe tool in this class typically brings probe hardware into contact with wafer sites so that electrical testing can be performed at wafer level.
The RECIF G 3 Plus Wafer belongs in the test and probe portion of semiconductor manufacturing.[1]
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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Alignment is typically achieved through optical cameras that locate alignment marks on the wafer, combined with precision stage motion to align the wafer to the probe card before contacting.
Throughput varies widely based on the number of dies, test complexity, and probe card configuration, but these systems are designed to balance speed with accurate placement and reliable electrical contact.
Probe cards require periodic cleaning to remove debris and maintain low contact resistance, along with inspection for needle damage or wear. Some systems include automatic cleaning and calibration routines.
The following facts about the G 3 Plus Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the G 3 Plus Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the G 3 Plus Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the G 3 Plus Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the G 3 Plus Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the G 3 Plus Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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