Plasma-Therm
Versaline
The Plasma-Therm Versaline is a platform used for Plasma-Enhanced Chemical Vapor Deposition (PECVD), Chemical Vapor Deposition (CVD), and deep reactive ion etching (DRIE) of silicon. The Versaline PECVD variant is configured for 4-inch wafers. The Versaline DRIE variant provides etch selectivity to photoresist of 100:1, to SiO2 as high as 340:1, and to Al2O3 of approximately 1000:1.[1]
What it is
The Plasma-Therm Versaline is a semiconductor deposition platform used for plasma-enhanced chemical vapor deposition.[4][6]
How it works
The Versaline name also appears on plasma-based etch tools, and inductively coupled plasma systems use separate source and bias power paths to control plasma density and ion energy independently.[5]
Where it fits in the process flow
The Plasma-Therm Versaline sits in the thin-film deposition portion of a semiconductor process flow.[6]
Applications
What do the numbers mean?
Power & electrical2
Wafer handling3
Gas & chemistry3
- Processable materials
- Silicon, SiO2, Si3N4, SiOxNy, polymer films such as PMMA, photoresist, polyimide[3]
Optics & imaging3
Control & software2
- Versaline Software[2]
Configuration & options23
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Versaline PECVD | — | — | Identified as Plasma-Enhanced Chemical Vapor Deposition. | Equipment inventory listing[4] |
| Versaline CVD | — | — | Listed as a CVD system with 3 Chamber Deposition, PCVD Versaline Chambers (x2), HDP-CVD Versaline Chamber, PM Modules (x3), Brooks MX 600, HDD, Versaline Software, and Manuals. | Equipment inventory listing[2] |
| Plasmatherm Versaline CVD | — | — | 3-chamber configuration with 2 PCVD Versaline chambers and 1 HDP-CVD Versaline chamber, plus 3 PM modules and Brooks MX 600 handler | Equipment inventory listing[2] |
| Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE) | — | — | Configured for deep silicon etching using alternate gas technique similar to Bosch process | snfguide.stanford.edu[5] |
| Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox) | — | — | Configured for etching silicon oxide and deep glass/quartz | snfguide.stanford.edu[5] |
| Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL) | — | — | Configured for etching metals and metal-based compounds with volatile bi-products | snfguide.stanford.edu[5] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- How to edit recipeDocumentucsb.edu
- CNS Consolidated RatesDocumentharvard.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Versaline are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Versaline are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Versaline are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Versaline are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Versaline is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Versaline are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (12)Every fact above is drawn from these public sources
- [1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [2]Inventory photo
- [3]pnf.uchicago.edupnf.uchicago.edu
- [4]Equipment inventory listing
- [5]snfguide.stanford.edu — snfguide.stanford.edusnfguide.stanford.edu
- [6]Capabilities | UD Nanofabrication Facility — udnf.udel.eduudnf.udel.edu
- [7]Plasma-Therm Versaline ICP RIE - Claire & John Bertucci Nanotechnology Laboratory - College of Engineering - Carnegie Me — nanofab.ece.cmu.edunanofab.ece.cmu.edu
- [8]Plasma-Therm Versaline PECVD OEI recipe development How-To - Equipment - nanoFAB Confluence — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [9]Tool Details - Harvard CNS — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [10]How to edit recipe — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [11]IBE – When to Use Ion Beam Etching — blog.plasmatherm.com (Dec 22, 2021)web.archive.org
- [12]Plasma-Therm: MEMS/NEMS — plasma-therm.com (May 28, 2021)web.archive.org
Last updated Oct 6, 2026.
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