Palomar
LCC 8000 Wire Bonder & Ball Bumper
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Palomar LCC 8000 is a wire bonder and ball bumper used in semiconductor packaging. The machine combines two functions: wire bonding for creating electrical interconnections and ball bumping for forming solder bumps on a die.[1][2]
How it works
General reference — not yet source-verifiedThe machine uses precise mechanical stages to position the bonding head over each pad. Computer-controlled parameters such as bond force, ultrasonic power, and time are set per application. The wire is fed through the capillary from a spool, and the bond is made in a sequence of loop and tail profiles.
Applications
General reference — not yet source-verifiedMaterials commonly bonded include gold, copper, and aluminum wire. The machine can bond to substrates made of organic laminates, ceramics, or leadframes. The dual-function capability reduces handling and improves throughput for processes that require both wire bonds and bumps.
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the LCC 8000 Wire Bonder & Ball Bumper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the LCC 8000 Wire Bonder & Ball Bumper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the LCC 8000 Wire Bonder & Ball Bumper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the LCC 8000 Wire Bonder & Ball Bumper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the LCC 8000 Wire Bonder & Ball Bumper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the LCC 8000 Wire Bonder & Ball Bumper is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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