Oxford Instruments
Plasmalab 800 Plus RIE
The Oxford Instruments Plasmalab 800 Plus RIE is a reactive ion etching system. The Oxford Instruments Plasmalab 800 Plus RIE uses a PC controller providing an intuitive user interface. The Oxford Instruments Plasmalab 800 Plus RIE keeps its footprint minimal by locating all electronics and vacuum components within the tool body.[1][2]
What it is
General reference — not yet source-verifiedThe Plasmalab 800 Plus RIE is a reactive ion etching (RIE) tool, a category of plasma-based etchers widely used in semiconductor and microelectromechanical systems (MEMS) fabrication. RIE systems combine physical ion bombardment with chemical reactive species to remove material from a substrate in a patterned manner.
Where it fits in the process flow
General reference — not yet source-verifiedRIE tools such as this are used after photolithographic patterning to transfer resist patterns into underlying layers, including dielectrics, metals, and semiconductors. In the overall process flow, RIE is a subtractive patterning step, positioned between lithography and resist stripping, and is also employed for contact hole etching, gate definition, and MEMS release processes. Repeated use in both front-end-of-line (FEOL) and back-end-of-line (BEOL) integration schemes is common.
What do the numbers mean?
Power & electrical1
- Advanced Energy RFX 600A RF supply[3]
Vacuum & pumping4
Control & software2
- Advanced Energy TCM tuner controller[3]
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationAdvanced Energy RFX 600A RF supply[3]
- ConfigurationLeybold Harris Turbotronik NT20 turbopump controller[3]
- ConfigurationLeybold TMP-361C turbopump[3]
- ConfigurationBusch Cobra BA100 vacuum pump[3]
- Footprint designAll electronics and vacuum components located within the tool body to minimize footprint[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of films can a reactive ion etcher typically etch?General reference — not yet source-verified
An RIE etcher can etch a wide variety of films, including silicon, silicon dioxide, silicon nitride, aluminum, tungsten, refractory metals, and many organic materials. The exact selectivity depends on the gas chemistry and process conditions chosen.
Why is anisotropy important in plasma etching?General reference — not yet source-verified
Anisotropic etching produces vertical, well-defined sidewalls, which is essential for achieving accurate pattern transfer in microdevices. The directional ion bombardment in RIE minimizes undercutting, enabling higher feature density and fidelity.
What are the main process parameters controlled during an RIE etch?General reference — not yet source-verified
Key parameters include gas type and flow rates, chamber pressure, RF power (both plasma and bias), electrode temperature, and end-point detection. Balancing these controls the etch rate, uniformity, selectivity, and profile.
How does RIE compare to wet etching for microfabrication?General reference — not yet source-verified
RIE generally provides better anisotropy and cleaner pattern transfer than isotropic wet etching, but may introduce plasma-induced damage. Wet etching offers higher selectivity in some cases and is simpler, but it lacks the directional control needed for critical dimensions.
What maintenance considerations apply to machines of this class?General reference — not yet source-verified
Regular chamber cleaning, electrode conditioning, and replacement of consumable parts are typical. Managing process drift and maintaining reproducible chamber conditions are important for consistent etching results.
Not publicly documented
The following facts about the Plasmalab 800 Plus RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 800 Plus RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 800 Plus RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 800 Plus RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 800 Plus RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 800 Plus RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [2]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
Last updated Sep 28, 2026.
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