Oxford Instruments

Plate 01Video 1 Oxford Plasmalab 100 ICP System ID# 3589
Plate 02Oxford Plasmalab 100 ICP (ID# 4162)
Plate 03Oxford Plasmalab 100 ICP Etcher (ID# 3811)
Plate 04Oxford Plasmalab 100 ICP (ID# 3894)
The specific model is configured to process six-inch wafers and operates on a 208V, 50/60Hz electrical supply. The system includes a VAT PM-5 adaptive pressure controller, an Adixen ACT 1300M turbopump controller, a Leybold D65BCS vacuum pump, a gas box, two chillers (Thermo Neslab and OptiTemp OTI-5WL-P3-216), a control computer (without a hard disk drive), an LCD monitor, and a computer cart.[1][2]
The Plasmalab 100 ICP 180 RIE incorporates a VAT PM-5 adaptive pressure controller for precise regulation of process chamber pressure. Vacuum is maintained by an Adixen ACT 1300M turbopump controller backed by a Leybold D65BCS vacuum pump. Process gases are delivered through an integrated gas box.[1][2]
Reactive ion etchers are typically placed in a semiconductor fab after the lithography step, where they transfer photoresist patterns into underlying layers of material. The etched features are then followed by resist stripping, inspection, and subsequent deposition or processing steps.
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Yes, it includes a Thermo Neslab chiller and an OptiTemp OTI-5WL-P3-216 chiller.[1][2]
The system includes an Adixen ACT 1300M turbopump controller and a Leybold D65BCS vacuum pump with oil filter and exhaust filter.[1][2]
The following facts about the Plasmalab 100 ICP 180 RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 ICP 180 RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 100 ICP 180 RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 100 ICP 180 RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 100 ICP 180 RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 100 ICP 180 RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 10, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
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Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.