Oxford Instruments
800 Plus RIE
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Oxford Instruments 800 Plus RIE is a reactive ion etching system. The system belongs to the Plasmalab 800 family of plasma processing tools.[2]
How it works
The system uses a PC controller providing an intuitive user interface. All electronics and vacuum components are located within the tool body to minimize footprint. The system incorporates an Advanced Energy RFX 600A RF supply and a Leybold TMP-361C turbopump.[2]
Where it fits in the process flow
General reference — not yet source-verifiedReactive ion etching is used after photolithographic patterning to transfer resist patterns into underlying layers. In the overall fabrication flow, RIE is a subtractive patterning step positioned between lithography and resist stripping. The process is employed in both front-end-of-line and back-end-of-line integration schemes.
Applications
General reference — not yet source-verifiedRIE systems such as this are used to etch dielectrics, metals, and semiconductors for integrated circuits and microelectromechanical systems (MEMS). Materials commonly processed include silicon, silicon dioxide, silicon nitride, aluminum, and tungsten.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- May have missing parts
What do the numbers mean?
Power & electrical2
Vacuum & pumping5
Wafer handling1
Control & software1
Configuration & options2
- may have missing parts[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- FootprintAll electronics and vacuum components located within tool body to minimize footprint[2]
- RF supplyAdvanced Energy RFX 600A[2]
- Tur bpumpLeybold TMP-361C[2]
- Tur bpump controllerLeybold Harris Turbotronik NT20[2]
- Vacuum pumpBusch Cobra BA100[2]
- Elecrical supply208 VAC, 3 Phase[3]
- Included subsystemsProcess chamber, gas-delivery and control enclosure, cooling and shutter controls, pumping/control computer[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 800 Plus RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 800 Plus RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 800 Plus RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 800 Plus RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 800 Plus RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 800 Plus RIE are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]exapro.comexapro.com
Last updated Oct 11, 2026.
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